Yeah It helps alot, I am actually running an AMD Athlon 1.2GHz and I have had that for over 6 Months now and there has been no problems and the one before that was an Athlon I think.
Thanx people :)
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Yeah It helps alot, I am actually running an AMD Athlon 1.2GHz and I have had that for over 6 Months now and there has been no problems and the one before that was an Athlon I think.
Thanx people :)
With reference to KissCools comment about CPU indentification numbers (which Pentiums have and AMD do not), this is not a problem, as you can disable the processor ID 'feature' in the BIOS settings on most motherboards. Don't you just love the use of the word 'feature' :D By default, it is turned on, so good idea to get in there and disable it if you are running a p3/p4.
I only trust in AMD chips, I got an Athlon 1 Ghz and I never would buy an processor of an
another manufactor because AMD builds my processors in my hometown :D
AMD Athlon (XP+) and Intel P4's are both fast and reliable chips. Both tend to generate a lot of heat (AMD more then P4) Therefor cooling is one of the most important things. Cyrix/IBM cpu's for instance were trouble makers at that point. btw for all cyrix chip owners: http://wauug.erols.com/~balsa/linux/cyrix/ has info on how to optimize your cyrix cpu in Linux, it also contains usefull general information.
A little tutorial on cooling (source:http://wauug.erols.com/~balsa/linux/cyrix/)
CPU FAN
A small marking on the side of the fan indicates the direction of vertical and horizontal air flow. The vertical air flow is always downwards, and the horizontal air flow should be directed to the on-board voltage regulator heatsinks. The fan can always be unscrewed and rotated to obtain the correct air flow. Note the pass-through power connector.
SILICON THERMAL COMPOUND
The need to use silicon thermal compound arises from the fact that metal surfaces are not perfectly flat i.e. a very thin air gap exists between the CPU top metal cover and the heatsink. The problem is that air, short of total vacuum, is one of the best heat insulators. This is clearly undesirable.
Silicon thermal compound is a white paste which you can find at most Radio Shack stores in small tubes of 10g, for less than $2. Silicon paste by itself is not a good heat conductor; the addition of Zinc oxide powder provides it with the desired thermal conducting characteristics, and also gives the paste its white color. You should use as little paste as possible to evenly cover the CPU's top metal surface with a thin layer.
A much neater solution is a grey polymer found on the underside of some CPU heatsinks (e.g. Cyrix labeled heatsinks), in the form of a very thin 38x38mm (1.5x1.5") square . This heat conducting polymer molds itself to the CPU top cover, hence eliminating any air bubbles and providing a nearly perfect heat junction. It also avoids messing with the silicon paste. If your heatsink has this polymer, do not use silicon compound.
I am a intel user P111 AND P4
AMD is faster due to its larger L1 cache
My speed solution was to cool my cpu and northbridge chips right down
and to use plenty of ram
Mike
Ya think the CPU brand is a headache.. try susing out Motherboards..
I'm specing my upgrade now.. chosen the AMD XP 2000 , but the Mobo .. ASUS, MSI, Gigabyte.
dunno yet.. tomorrow..
Cheers